Principal PKG Development Engineer

Qorvo (Nasdaq: QRVO) supplies innovative semiconductor solutions that make a better world possible. We combine product and technology leadership, systems-level expertise and global manufacturing scale to quickly solve our customers' most complex technical challenges. Qorvo serves multiple high-growth segments of large global markets, including consumer electronics, smart home/IoT, automotive, EVs, battery-powered appliances, network infrastructure, healthcare and aerospace/defense. Visit www.qorvo.com to learn how our innovative team is helping connect, protect and power our planet.

Position:Principal Packaging Development Engineer

Locations: Hanoi, Vietnam

Overview:

Qorvo seeks a seasoned Packaging Development Engineer with a robust background in semiconductor packaging development and integration. This role involves leading new packaging technologies and assembly capabilities, with a focus on SMT process expertise and innovation in packaging solutions.

Responsibilities:

• Develop and integrate new semiconductor packaging technologies.

• Manage technical projects for packaging technology advancement.

• Serve as a lead expert in packaging assembly processes, especially SMT.

• Innovate in package design, processes, and materials for next-generation solutions.

• Offer technical guidance during development phases and address high-volume production challenges.

• Spearhead projects from concept through to qualification and production in collaboration with R&D.

• Support technical customer engagements and problem resolution.

• Drive continuous process improvement (CPI) in packaging and support cross-functional areas.

• Collaborate with offshore assembly, substrate partners, and suppliers.

• Present project updates to executive management and contribute to patent creation.

Qualifications:

• Bachelors degree in Mechanical, Microelectronics, or Materials Engineering. Master’s degree in Mechanical, Microelectronics, or Material Engineering preferred .

• 10+ years experience in packaging or semiconductor assembly.

• Strong leadership and project management skills in packaging and assembly tech.

• Expertise in package design and SMT process development.

• Experience with heterogeneous integration, SiP, and various packaging forms.

• Proficiency in technology/assembly process development across SMT, Die Attach, Wire Bond, etc.

• Exceptional communication skills for idea sharing and presenting to large groups.

• Familiarity with high volume manufacturing, ideally in the cellular handset market.

• Solid problem-solving skills; Lean and/or Six Sigma certification is a plus.

• Knowledge of JEDEC, AEC Q100/200, and TS16949 automotive standards.

Application:

Interested candidates are encouraged to apply, demonstrating their innovative contributions to packaging technology and leadership capabilities.

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MAKE A DIFFERENCE AT QORVO

We are Qorvo. We do more than create innovative RF and Power solutions for the mobile, defense and infrastructure markets – we are a place to innovate and shape the future of wireless communications. It starts with our employees. As a unified global team, we bring a commitment to excellence, growth and a passion for creating what's next. Explore the possibilities with us.

We are an Equal Employment Opportunity (EEO) employer and welcome all qualified applicants. Applicants will receive fair and impartial consideration without regard to any characteristics protected by applicable law, including race, color, religion, sex (as defined by law), national origin, age, military or veteran status, genetic information, or disability.