Job Summary:
Introduces and maintains assembly processes and activities to ensure the requested requirements from manufacturing and quality are achieved. Cross-functional work with Central Engineering and other manufacturing teams to transfer, qualify and ramp-up of new product/package/technology.
Responsibilities
• Report to NPI leader in coordination with R&D New Products Development group to develop strategy for new products.
• Provide engineering support for all activities in product development process.
• Responsible to new product/package/technology transfer, production setup and validation running in the factory and ramp up to production.
• Drive integrations, cross-functional work with other manufacturing departments, and ramp-up of volume/yield/cost/stability and quality of new technologies into production.
• Define risk assessment and risk mitigations plan, Bill of Material (BOM) selection, process flow.
• Technical gap analysis, Design for Manufacturability, cost competitiveness in consideration.
• Troubleshoot, investigate, root cause analysis into qualification failure and method issues.
• Material and equipment and manufacturing peripheral selection to meet quality, reliability, cost, yield, and production targets.
• Drive improvement project and work with unit process to improve stability, yield, cost and quality.
• Successfully implement and Fan-out new product from an engineering build to manufacturability environment by using tools such as design factorial DOE, SIPOC and Lean Six Sigma.
Qualifications
• BS/MS in Electrical, Mechanical Engineering, Material Engineering or equivalent.
• A minimum of 5 years or more experience in semiconductor packaging and manufacturing.
• Experiences in assembly and test processes of wire bond, dicing, die attach, especially on Au, Cu, Al wire bonding.
Requirements
• Proficiency in Engineering Tools such as AutoCAD, 8D, SPC, DFMEA, DOE.
• Lead project across organization and culture in a fast-paced environment.
• Teamwork and able to work independently.
• Solder ball, Cu pillar, hybrid, thermocompression, and novel bonding techniques
• Power module packaging, reliability, and chip package (CPI) experiences.
• Semiconductor or silicon/silicon carbide wafer processing experience a plus.
• Experience in data analysis using JMP, Minitab, Power BI…
More details about our company benefits can be found here:
https://www.onsemi.com/careers/career-benefits
